Encyclopedia of thermal packaging :  thermal packaging techniques / 
editor-in-chief Avram Bar-Cohen 
 - 6 volumenes (xiv, 226; xvi 188; xxi, 359; xix, 236; xv, 148; xvii, 286 páginas) :  ilustraciones 
<br/><br/> Microchannel heat sinks for electronics cooling /  Air- and liquid-cooled cold plates /  Dielectric liquid cooling of immersed components /  Thermoelectric microcoolers /  Energy efficienct solid state lighting /  Experimental thermofluid characterization of electronic components /  Suresh V. Garimella, Tannaz Harirchian --  Allan Kraus --  Karl J. L. Geisler. Avram Bar-Cohen --  Bao Yang, Peng Wang --  Mehmet Arik, Anant Setlur, Stanton E. Weaver Jr., Joseph J. Shiang --  Gary L. Solbrekken  Vol. 1.  v. 2.  v. 3.  v. 4.  v. 5.  v. 6. 
<br/><br/><label>ISBN: </label>9789814313780 (obra completa) 9814313785 (obra completa) 9814313807 (volumen 1) 9789814313803 ((volumen 1) 9814313815 (volumen 2) 9789814313810 (volumen 2) 9814313823 (volumen 3) 9789814313827 (volumen 3) 9814313785 (volumen 4) 9789814313834 (volumen 4) 9814313785 (volumen 5) 9789814327619 (volumen 5) 981432762X (volumen 6) 9789814327626 (volumen 6) 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Encapsulado electrónico<br/>Aisladores térmicos
<br/><br/><label>LC Class. No.: </label>TK7870.15  / E56