TY  - BOOK
AU  - Bar-Cohen,Avram
TI  - Encyclopedia of thermal packaging: thermal packaging techniques 
SN  - 9789814313780 (obra completa)
AV  - TK7870.15 E56
PY  - 2013///
CY  - Singapore
PB  - World Scientific
KW  - Encapsulado electrónico
KW  - Aisladores térmicos
N1  - Vol. 1; Microchannel heat sinks for electronics cooling; Suresh V. Garimella, Tannaz Harirchian --; v. 2; Air- and liquid-cooled cold plates; Allan Kraus --; v. 3; Dielectric liquid cooling of immersed components; Karl J. L. Geisler. Avram Bar-Cohen --; v. 4; Thermoelectric microcoolers; Bao Yang, Peng Wang --; v. 5; Energy efficienct solid state lighting; Mehmet Arik, Anant Setlur, Stanton E. Weaver Jr., Joseph J. Shiang --; v. 6; Experimental thermofluid characterization of electronic components; Gary L. Solbrekken
ER  -