| 000 | 01934nam a2200397zi 4500 | ||
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| 005 | 20220224111632.0 | ||
| 008 | 130724s2013 si a 000 0 eng d | ||
| 020 | _a9789814313780 (obra completa) | ||
| 020 | _a9814313785 (obra completa) | ||
| 020 | _a9814313807 (volumen 1) | ||
| 020 | _a9789814313803 ((volumen 1) | ||
| 020 | _a9814313815 (volumen 2) | ||
| 020 | _a9789814313810 (volumen 2) | ||
| 020 | _a9814313823 (volumen 3) | ||
| 020 | _a9789814313827 (volumen 3) | ||
| 020 | _a9814313785 (volumen 4) | ||
| 020 | _a9789814313834 (volumen 4) | ||
| 020 | _a9814313785 (volumen 5) | ||
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| 020 | _a981432762X (volumen 6) | ||
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_aUNAMX _bspa _erda _cUNAMX |
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| 050 | 4 |
_aTK7870.15 _bE56 |
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| 245 | 0 | 0 |
_aEncyclopedia of thermal packaging : _bthermal packaging techniques / _ceditor-in-chief Avram Bar-Cohen |
| 264 | 1 |
_aSingapore : _bWorld Scientific, _cc2013 |
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| 300 |
_a6 volumenes (xiv, 226; xvi 188; xxi, 359; xix, 236; xv, 148; xvii, 286 páginas) : _bilustraciones |
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| 505 | 0 | 0 |
_gVol. 1. _tMicrochannel heat sinks for electronics cooling / _rSuresh V. Garimella, Tannaz Harirchian -- _gv. 2. _tAir- and liquid-cooled cold plates / _rAllan Kraus -- _gv. 3. _tDielectric liquid cooling of immersed components / _rKarl J. L. Geisler. Avram Bar-Cohen -- _gv. 4. _tThermoelectric microcoolers / _rBao Yang, Peng Wang -- _gv. 5. _tEnergy efficienct solid state lighting / _rMehmet Arik, Anant Setlur, Stanton E. Weaver Jr., Joseph J. Shiang -- _gv. 6. _tExperimental thermofluid characterization of electronic components / _rGary L. Solbrekken |
| 650 | 4 | _aEncapsulado electrónico | |
| 650 | 4 | _aAisladores térmicos | |
| 700 | 1 |
_aBar-Cohen, Avram, _d1946- , _eeditor |
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| 336 |
_atexto _2rdacontent |
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| 337 |
_asin medio _2rdamedia |
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| 338 |
_avolumen _2rdacarrier |
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_c8847 _d8847 |
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